Aluminum Stacked fin soldered on Copper base with 4x Heat Pipes embedded for 2U server & up solution up to TDP 205 Watts heat dissipation CPU Support Intel CPU Socket FCLGA3647 Solution 2U Server and Up Dimension 108.0 x 80.0 x 64.0 mm Weight 600 g Material Aluminum Stacked fin soldered on Copper base with 4x Heat Pipes embedded Thermal Grease Shin-Etsu 77.
Specifications- CPU Socket: FCLGA3647
- Solution: 2U Server and Up
- Material: Aluminum Heatsink & Copper Base
- Thermal Grease: Shin-Etsu 7762
- Dimension: 90.0 x 90.0 x 64.0 mm